PROCESS FOR FORMING ORGANIC SEMICONDUCTOR FILM

摘要

In the present invention, an organic semiconductor film is formed by using a cover member which is disposed on a substrate for forming the organic semiconductor film and forms a space relative to the substrate, filling the space between the cover member and the substrate with a solution, and drying the filled solution, wherein the cover member has a control surface on which an uppermost part most separated from the substrate and a descending part provided on both sides in the y-direction of the uppermost part so as to descend from the uppermost part toward the substrate are formed.

主权项

1. A method for forming an organic semiconductor film in which, when a solution in which an organic semiconductor material is dissolved is used so as to form an organic semiconductor film including the organic semiconductor material;
the organic semiconductor film is formed by using a cover member which is disposed on a substrate for forming the organic semiconductor film and forms a space relative to the substrate, filling the space between the cover member and the substrate with the solution, and drying the filled solution; wherein the cover member has a control surface on which an uppermost part most separated from the substrate and a descending part provided on both sides in the y-direction of the uppermost part so as to descend from the uppermost part toward the substrate are formed; the cover member has a shape that opens in the x-direction orthogonal to the y-direction of the space where the control surface is formed; and the cover member is disposed in a state in which the entire area of at least one end part in the y-direction makes contact with the substrate with the control surface facing the substrate; when an end part in the y-direction where the entire area of the cover member makes contact with the substrate is used as a base end, at least a part of the solution at the end part in the y-direction on the opposite side from the base end on the control surface is positioned at a location not surpassing the uppermost part of the control surface when viewed from the base end; and an apparent angle, which is an angle formed by (i) the shortest line connecting the base end and a separation position serving as a position where the solution is most separated from the base end in the y-direction on the control surface and (ii) the shortest line connecting the base end and a point where a perpendicular line dropped from the separation position onto the substrate intersects with the substrate, is at most 50°; and the base end side of the space between the cover member and the substrate is filled with the solution so that a ratio x/y determined by dividing the length in the x-direction by the length in the y-direction is at least 0.2.