| 摘要 |
PROBLEM TO BE SOLVED: To provide a package substrate that can increase the signal transmission speed between electronic components and has a high flexibility in wiring.SOLUTION: A package substrate has a connection path PR that is formed via a pad 76SPR connected to a memory 110M, a via conductor 160FaR, a first conductor circuit 158Fas, another via conductor 160FaR, an outermost conductor circuit 158Fbs, and a skip via conductor 160Fb. Since the connection path (bypass) PR is provided, the package substrate has a high flexibility in wiring. |
