| 摘要 |
PROBLEM TO BE SOLVED: To perform high-accuracy alignment of a substrate at high throughput, and perform high-accuracy exposure of a wafer.SOLUTION: A control device, in a detection operation of marks of a wafer W and a reference mark of a measurement plate 30 by alignment systems (AL1, AL2to AL2), controls a driving system of a stage WST such that the wafer is relatively moved in a Y direction with respect to a plurality of detection regions in order to detect a plurality of marks of a wafer having different positions regarding the Y direction by at least a part of the plurality of detection regions of the alignment systems, controls the driving system such that the reference mark is arranged in one of the plurality of detection regions, controls the driving system such that a mark image is projected on a slit pattern in a detection operation of the mark image performed by a spatial image detection part, and controls the driving system by using detection information by the alignment system and detection information by the spatial image detection part, in an exposure operation of the wafer. |
