发明名称 ノズル、基板処理装置、および基板処理方法
摘要 <p><P>PROBLEM TO BE SOLVED: To reduce variations of the film thickness at collision positions in a substrate where droplets collide, thereby improving the uniformity of the processing. <P>SOLUTION: A cleaning nozzle 5 includes: an injection part 6 where multiple injection ports 31 are formed; and a discharge part 7 where a discharge port 36 is formed. The multiple injection ports 31 are formed so that multiple droplets collide with multiple collision positions P1 in a substrate W. The discharge port 36 is formed so that a protection liquid is applied to an application position P2 in the substrate W, the application position P2 being away from each of the collision positions P1 at an equal distance D. The cleaning nozzle 5 causes the multiple droplets injected from the multiple injection ports 31 to collide with the substrate W coated by a liquid film of the protection liquid discharged by the discharge port 36. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5837788(B2) 申请公布日期 2015.12.24
申请号 JP20110214935 申请日期 2011.09.29
申请人 株式会社SCREENホールディングス 发明人 荒木 浩之
分类号 H01L21/304;B05C11/10;G02F1/13;G02F1/1333;G11B5/84;G11B7/26 主分类号 H01L21/304
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