DIE LEVEL CHEMICAL MECHANICAL POLISHING

摘要

A method of polishing a wafer at the die level with a targeted slurry delivery system. The wafer is placed on a wafer carrier exposing the top side of the wafer, the wafer contains a die. The polishing apparatus will polish a portion of the die using a pad that is smaller than the die and the pad is located above the die. A slurry is applied to a portion of the die being polished. Embodiments of the invention provide multiple pads working on the same die.

主权项

1. An apparatus comprising:
a wafer carrier that is configured to harness a back side of a wafer such that a front side of the wafer is exposed; a pad, a pad carrier, and a polishing carrier, wherein the pad having a lower surface above the wafer carrier, the pad carrier located above the pad and connected to the pad, and the polishing carrier located above the pad carrier and connected to the pad carrier; and a slurry delivery system, wherein the slurry delivery system is located above the wafer carrier and the slurry delivery system is movable relative to the wafer carrier.