发明名称 MEMBER BONDING APPARATUS
摘要 To provide a member bonding apparatus that can accurately position two members for bonding. Member alignment preprocessing device 15 adjusts to align one of the two members received by member receiving device 11 with another member in X and Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond, adhesive application device 12 applies adhesive to a bonding surface of one of the two members approximately aligned, member alignment device 16 adjusts to align another member with one of the two members in X, Y, Z-axis and α, β, θ-axis directions based on images of the two members captured by a CCD camera so that positions of the bonding surfaces of the two members correspond, member bonding device 13 makes the bonding surfaces of the two members aligned be bonded to each other through the adhesive, and member delivery device 14 unloads and delivers the bonded member.
申请公布号 US2015370098(A1) 申请公布日期 2015.12.24
申请号 US201414764888 申请日期 2014.01.28
申请人 ORIGIN ELECTRIC COMPANY, LIMITED 发明人 YAMAGUCHI Koji;MATSUMOTO Yutaka;SHIMIZU Hisashi;OKAMOTO Tetsuya
分类号 G02F1/13;G02F1/1333 主分类号 G02F1/13
代理机构 代理人
主权项 1. A member bonding apparatus, comprising: a member receiving device for receiving two members to be bonded; a member alignment preprocessing device for adjusting to align one member of the two members received by the member receiving device with another member in X and Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond; an adhesive application device for applying an adhesive to a bonding surface of one member of the two members that are approximately aligned by the member alignment preprocessing device; a member alignment device for adjusting to align one member of the two members with another member in X, Y, Z-axis directions and α, β, θ-axis directions in accordance with images of the two members captured by a mounted CCD camera so that positions of the bonding surfaces of the two members correspond; a member bonding device for making the bonding surfaces of the two members aligned by the member alignment device be bonded to each other through the adhesive; and a member delivery device for unloading and delivering the bonded member that is bonded by the member bonding device.
地址 Toshima-ku, Tokyo JP