| 摘要 |
Adhesive compositions and methods of preparing an adhesive composition are described. The method comprises providing a syrup composition comprising a free-radically polymerizable solvent monomer and a solute (meth)acrylic copolymer, and radiation curing the syrup composition in the absence of an ionic photoacid generator. The solute (meth)acrylic copolymer comprises epoxy-functional groups, acid-functional groups, or a combination thereof. In some embodiments, an epoxy resin having on average greater than one polymerizable epoxy group per molecule or an acid comprising at least two carboxylic acid groups is utilized. The epoxy-functional groups and acid-functional groups of the (meth)acrylic copolymer or the adhesive composition can readily crosslink in the absence of an ionic photoacid generator (PAG). |
