发明名称 |
GRAPHENE-METAL BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE HAVING GRAPHENE-METAL BONDING STRUCTURE |
摘要 |
Disclosed are a graphene-metal bonding structure, a method of manufacturing the same, and a semiconductor device having graphene-metal bonding structure. The graphene-metal bonding structure includes a graphene layer, a metal layer prepared on the graphene layer, and an intermediate layer which is prepared between the graphene layer and the metal layer. The boundary part of the material of the intermediate layer touches the metal layer to form edge-contact. |
申请公布号 |
KR20150144176(A) |
申请公布日期 |
2015.12.24 |
申请号 |
KR20140072972 |
申请日期 |
2014.06.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, JAE HO;SHIN, HYEON JIN;LEE, MIN HYUN;LEE, CHANG SEOK |
分类号 |
H01L29/78;H01L21/336 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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