| 摘要 |
PROBLEM TO BE SOLVED: To provide a selection method for selecting a liquid epoxy resin composition which has an excellent property to impregnate into a gap between a substrate and a semiconductor and is suppressed from occurrence of voids; and an electronic part device such as a semiconductor device using the liquid epoxy resin composition and having excellent reliability.SOLUTION: The selection method of a liquid epoxy resin composition for flip chip encapsulation comprises: preparing a group comprising liquid epoxy resin compositions containing epoxy resins, curing agents, and inorganic fillers; measuring viscosity and surface tension of the liquid epoxy resin compositions at an impregnation temperature; and selecting liquid epoxy resin compositions having the measured viscosity of 0.13 Pa s or less and the measured surface tension of 25 mN/m or more. The electronic part device comprises a cured product of a selected liquid epoxy resin composition which is filled in a gap between a substrate and a semiconductor device flip-chip mounted on the substrate. |
