EMBEDDED CHIP PACKAGING TECHNOLOGY

摘要

Representative implementations of devices and techniques provide a semiconductor package comprising a laminate substrate. The laminate substrate includes at least one conductive layer laminated to a surface of an insulating core. The laminate substrate also includes one or more die openings, in which one or more semiconductor die are located.

主权项

1. A method, comprising:
forming a laminate substrate, including laminating a first conductive layer to a first side of an insulating core layer; forming one or more die openings on the laminate substrate; locating one or more die within one or more of the die openings; forming an insulating retainer around the one or more die within the one or more die openings, arranged to retain the one or more die within the one or more die openings; and forming a partial metallization layer above the one or more die.