| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of achieving all of flexibility, chemical resistance, and plating resistance after photocuring at high levels.SOLUTION: The photosensitive resin composition contains (A) a binder polymer having a carboxyl group, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a melamine derivative, and (E) dicyandiamides. The photopolymerizable compound (B) contains at least one selected from (B1) a bisphenol A-based di(meth)acrylate and (B2) a urethane oligomer or monomer. The solid content of the component (E) is 0.1-10 pts.mass based on 100 pts.mass of the total solid content of the component (A) and the component (B). |
