发明名称 MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS
摘要 The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
申请公布号 US2015371974(A1) 申请公布日期 2015.12.24
申请号 US201514743967 申请日期 2015.06.18
申请人 X-Celeprint Limited 发明人 Bower Christopher;Meitl Matthew;Gomez David;Bonafede Salvatore;Kneeburg David;Fecioru Alin;Prevatte Carl
分类号 H01L25/075;H01L33/38;H01L33/62 主分类号 H01L25/075
代理机构 代理人
主权项 1. An inorganic light-emitting diode comprising: a conduction layer; an inorganic light-emitting layer disposed on a portion of the conduction layer, the conduction layer comprising a cantilever extension extending beyond an edge of the inorganic light-emitting layer; a first metal terminal disposed on a portion of the inorganic light-emitting layer; a second metal terminal disposed on the cantilever extension of the conduction layer, wherein a current supplied between the first metal terminal and the second metal terminal causes the inorganic light-emitting layer to emit light; and a dielectric layer disposed on at least a portion of the inorganic light-emitting layer, wherein the dielectric layer electrically isolates the first metal terminal from the second metal terminal, wherein the first and second metal terminals are on a same side of the inorganic light-emitting diode and are separated by a horizontal distance of from 100 nm to 20 μm.
地址 Cork IE