| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an insulating pattern forming method capable of easily forming a multilayer structure without performing a complicated etching process or the like, and to provide a resin composition.SOLUTION: There is provided the insulating pattern forming method comprising the steps of: [I] forming an organic pattern on a substrate; [II] embedding an insulating material in the spaces in the organic pattern; [III] removing the organic pattern to obtain a reverse pattern formed of the insulating material; [IV] and curing the obtained reverse pattern. There is also provided an insulating pattern forming material for a damascene process.</p> |
