发明名称 Semiconductor Device
摘要 A semiconductor device includes a substrate having a first conductivity type, a first heavily-doped region formed in the substrate and having the first conductivity type, a second heavily-doped region formed in the substrate and having the first conductivity type, and an embedded layer formed in the substrate and separated from the first and second heavily-doped regions. The embedded layer has a second conductivity type different from the first conductivity type. A portion of the embedded layer is beneath the first heavily-doped region. A third heavily-doped region is formed in the substrate, between the first and second heavily-doped regions, and contacting the embedded layer, and has the second conductivity type.
申请公布号 US2015372152(A1) 申请公布日期 2015.12.24
申请号 US201414309731 申请日期 2014.06.19
申请人 Macronix International Co., Ltd. 发明人 Chan Wing-Chor;Tsai Ying-Chieh
分类号 H01L29/808;H02M3/335 主分类号 H01L29/808
代理机构 代理人
主权项 1. A semiconductor device, comprising: a substrate having a first conductivity type; a first heavily-doped region formed in the substrate and having the first conductivity type; a second heavily-doped region formed in the substrate and having the first conductivity type; an embedded layer formed in the substrate and separated from the second heavily-doped regions region, the embedded layer having a second conductivity type different from the first conductivity type, a portion of the embedded layer being beneath the first heavily-doped region; a third heavily-doped region formed in the substrate, between the first and second heavily-doped regions, and contacting the embedded layer, the third heavily-doped region having the second conductivity type; and an insulating isolation layer formed on one side of the first, second, and third heavily-doped regions, wherein the embedded layer extends beneath the insulating isolation layer.
地址 Hsinchu TW