| 摘要 |
The present invention provides a substrate treating apparatus. The substrate treating apparatus according to an embodiment of the present invention comprises: a process chamber which provides a space in which a process for a substrate is performed, and includes a first controller to control the process to be performed; and a handler unit to transport the substrate into/out of the process chamber. The handler unit comprises: a buffer on which the substrate temporarily waits; a transport robot to transport the substrate between the buffer and the process chamber; and a second controller to control the handler unit. The second controller can check whether the handler unit can load/unload the substrate if a substrate loading/unloading signal is received from the first controller. |
