| 摘要 |
The present invention relates to a light emitting device, a manufacturing method thereof, a light emitting device package, and a lighting system. According to an embodiment, the light emitting device includes: a first conductive semiconductor layer; a second conductive semiconductor layer placed under the first conductive semiconductor layer; an active layer placed between the first and second semiconductor layers; multiple holes exposing a part of the first conductive semiconductor layer by penetrating through the active layer and the second conductive semiconductor layer from the bottom of the second conductive semiconductor layer; a first contact electrode electrically connected from the bottom of the second conductive semiconductor layer to the first conductive semiconductor layer through the holes; a first ion injection area laminated on the first conductive semiconductor layer in an upper part of the first contact electrode; a first electrode layer electrically connected to an insulating layer electrode placed between the holes and the first contact electrode; and a second electrode connected to the second conductive semiconductor layer. |
