| 发明名称 | Packaging process tools and packaging methods for semiconductor devices | ||
| 摘要 | Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region. | ||
| 申请公布号 | US9218999(B2) | 申请公布日期 | 2015.12.22 |
| 申请号 | US201414339203 | 申请日期 | 2014.07.23 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Lu Wen-Hsiung;Cheng Ming-Da;Lin Wei-Hung;Huang Kuei-Wei;Lin Chih-Wei;Lin Chun-Cheng;Liu Chung-Shi |
| 分类号 | B23Q3/00;H01L21/683;H01L21/56;H01L23/00 | 主分类号 | B23Q3/00 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A packaging tool for semiconductor devices comprising: a mechanical structure comprising a frame including a plurality of apertures adapted to retain a plurality of integrated circuit dies therein, wherein the plurality of apertures are uncovered, wherein the frame comprises at least one enclosed hollow region, wherein the plurality of apertures are spaced apart from the enclosed hollow region. | ||
| 地址 | Hsin-Chu TW | ||