| 摘要 |
PROBLEM TO BE SOLVED: To provide a contact jig for electroplating which enables execution of electroplating by using the same jig even when metal electrodes to be plated have various pattern shapes and a semiconductor production apparatus and a production method of a semiconductor device using the contact jig for electroplating.SOLUTION: A contact jig 20 for electroplating includes a planar base member 21 composed of a conductive material, a plurality of contact electrodes 24 arranged on the surface of the base member 21 in a two-dimensional form, and the like. The base member 21 is coated with an electrical insulation material, and the contact electrodes 21 are coated with an electrical insulation material, except for the tip part. A semiconductor production apparatus includes the contact jig 20 for electroplating, a holding stage 7 for holding a semiconductor substrate, a state movement mechanism 8 which changes the relative position between the holding stage 7 and the contact jig 20, and the like. |
