发明名称 |
LOGIC CELL, INTEGRATED CIRCUIT INCLUDING LOGIC CELL, AND METHODS OF MANUFACTURING THE SAME |
摘要 |
A logic cell includes: conductive regions which are formed on the first level on a substrate; a first line layer which is extended in a first direction on a second level higher than the first level on the substrate, and is connected to a first conductive region selected among the conductive regions through a via contact; a second line layer which is extended in a second direction intersecting with the first direction on a third level higher than the second level on the substrate, and is connected to a second conductive region selected among the conductive regions; and a deep via contact which is extended from the second conductive region to the second line layer in a position separated from the first line layer. |
申请公布号 |
KR20150141777(A) |
申请公布日期 |
2015.12.21 |
申请号 |
KR20140070272 |
申请日期 |
2014.06.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LAU VINCENT CHUN FAI;DO, JUNG HO;KIM, BYUNG SUNG;PARK, CHUL HONG |
分类号 |
H01L21/768;H01L21/60 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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