发明名称 LOGIC CELL, INTEGRATED CIRCUIT INCLUDING LOGIC CELL, AND METHODS OF MANUFACTURING THE SAME
摘要 A logic cell includes: conductive regions which are formed on the first level on a substrate; a first line layer which is extended in a first direction on a second level higher than the first level on the substrate, and is connected to a first conductive region selected among the conductive regions through a via contact; a second line layer which is extended in a second direction intersecting with the first direction on a third level higher than the second level on the substrate, and is connected to a second conductive region selected among the conductive regions; and a deep via contact which is extended from the second conductive region to the second line layer in a position separated from the first line layer.
申请公布号 KR20150141777(A) 申请公布日期 2015.12.21
申请号 KR20140070272 申请日期 2014.06.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LAU VINCENT CHUN FAI;DO, JUNG HO;KIM, BYUNG SUNG;PARK, CHUL HONG
分类号 H01L21/768;H01L21/60 主分类号 H01L21/768
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