| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite material that has performance required as a buffer layer for a power module and can be manufactured at low cost, a laminate containing the composite material, and a power module that can relax thermal stress between a substrate and a cooler while suppressing reduction of a thermal conduction efficiency.SOLUTION: A power module 1 has a substrate 10 having a semiconductor chip 16 mounted on one surface thereof, a buffer layer 11 formed on another surface of the substrate 10, and a cooler 12 which has a planar substrate 12a and a cooling part 12b provided on one surface of the substrate 12a, and is adhesively attached to the buffer layer 11 through another surface of the base part 12a. The buffer layer 11 is formed by accelerating mixture powder of copper powder and power of additive material formed of one of iron-nickel alloy, tungsten and molybdenum together with gas, and the mixture powder is sprayed and deposited onto the surface of a base material while the mixture powder is kept under a solid-phase state. The additive material is a composite material having a volume content ranging from more than 0% to less than 20%. |
