| 摘要 |
Provided is a method to process a substrate made of a brittle material, comprising: a step of laser machining a front surface of a substrate at a certain depth and at a regular intervals spaced in accordance with a guide line provided; and a step of laser machining the substrate from a back surface to the front surface direction along a substrate processing line. As such, the method to process the substrate made of the brittle material enables to improve manufacturing efficiency and reduce a rate of defect by reducing chipping of a substrate when cutting a substrate made of a brittle material. |
