| 发明名称 |
POLISH APPARATUS, POLISH METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
A polish apparatus including a rotatable table configured to receive a polish pad having a polish surface; a polish head configured to hold a polish object and configured to be capable of placing the polish object in contact with the polish surface while holding the polish object; at least one contact portion being provided with a contact surface and configured to be capable of contacting the polish surface when the table is in rotation; and a measurement portion configured to measure a state of the contact surface of the contact portion being configured to contact the polish surface of the polish pad. |
| 申请公布号 |
US2015364389(A1) |
申请公布日期 |
2015.12.17 |
| 申请号 |
US201514641734 |
申请日期 |
2015.03.09 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
FUKUSHIMA Dai;TAKAYASU Jun;WATANABE Takashi |
| 分类号 |
H01L21/66;H01L21/67;B24B49/12;H01L21/3105;B24B37/013;B24B49/10 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polish apparatus comprising:
a rotatable table configured to receive a polish pad having a polish surface; a polish head configured to hold a polish object and configured to be capable of placing the polish object in contact with the polish surface while holding the polish object; at least one contact portion being provided with a contact surface and configured to be capable of contacting the polish surface when the table is in rotation; and a measurement portion configured to measure a state of the contact surface of the contact portion being configured to contact the polish surface of the polish pad. |
| 地址 |
Minato-ku JP |
