| 摘要 |
PROBLEM TO BE SOLVED: To provide: a method for manufacturing a semiconductor wafer with an adhesive layer, by which a semiconductor wafer with an adhesive layer sufficiently reduced in voids at a bump portion, and capable of sufficiently reducing warpage after grinding can be obtained; a method for manufacturing a semiconductor device using such a semiconductor wafer with an adhesive layer; and a method for manufacturing a semiconductor wafer with a semiconductor element.SOLUTION: A liquid photosensitive adhesive of the present invention is a liquid photosensitive adhesive for forming a photosensitive adhesive layer on a circuit surface of a semiconductor wafer that has the circuit surface on which a metal bump is formed, and includes (A) a radiation polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin, the (A) component including imide group-containing (meth)acrylate with one carbon-carbon double bond in a molecule. |
