| 摘要 |
A process for fabricating a LED lighting apparatus includes disposing a composite coating on a surafce of a LED chip, The composite coating comprises a first composite layer having a manganese doped phosphor of formula I and a first binder and a second composite layer comprising a second phosphor composition and a second binder. The first binder, the second binder or both include a poIy(meth)acrylate. Ax [MFy]:Mn4+.......... (I), wherein A is Li, Na. K, Rb, Cs, or a combination thereof; M is Si, Ge, Sn, Ti, Zr, AL Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or a combination thereof; x is the absolute value of the charge of the [MFy] ion; y is 5, 6 or 7. |
