CONFIGURABLE HEAT TRANSFER GRIDS AND RELATED METHODS

摘要

Configurable heat transfer grids that provide cooling to computing components are discussed herein. Some embodiments may include a configurable heat transfer grid comprising a cooling frame and one or more cooling elements. The cooling frame may define a plurality of receptacles that are each configured to receive one or more cooling elements. The one or more cooling elements may include an elongated shape and may be configured to be disposed within one or more of the plurality of receptacles, such as through apertures at outer ends of the cooling frame. The cooling elements may include heat pipes and/or heat spreaders. Some embodiments may provide for configurable heat transfer grids that include split cooling frames that can be opened for cooling element placement. Some embodiments may further provide for configuring a configurable heat transfer grid to implement effective and inexpensive heat removal for a wide range of specific printed circuit board assembly (PCBA) layouts, dimensions, and component types.

主权项

1. A self-contained heat transfer grid, comprising:
a cooling frame, the cooling frame defining a first cooling plane and a second cooling plane and having a first outer end and a second outer end, each of the first outer end and the second outer end including one or more apertures that define a plurality of receptacles between the first and second cooling planes; and one or more removable cooling elements, the one or more cooling elements having an elongated shape and positionable within one or more of the plurality of receptacles.