CIRCUIT STRUCTURE AND FABRICATION METHOD THEREOF

摘要

A circuit structure is provided, which includes a plurality of conductive posts, and a plurality of first and second conductive pads formed on two opposite end surfaces of the conductive posts, respectively. A length of each of the first conductive pads is greater than a width of the first conductive pad so as to reduce an occupation area of the first conductive pad along the width and increase a distance between adjacent first conductive pads, thereby increasing the wiring density and meeting the wiring demand.

主权项

1. A circuit structure, comprising:
a plurality of conductive posts each having opposite first and second end surfaces; a plurality of first conductive pads bonded to the first end surfaces of the conductive posts, wherein a length of each of the first conductive pads is greater than a width of the first conductive pad; and a plurality of second conductive pads bonded to the second end surfaces of the conductive posts.