| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device capable of achieving high light extraction.SOLUTION: A method of manufacturing a light-emitting device where a light-emitting element is flip-chip mounted on a support includes a first step for preparing a structure including a semiconductor layer including first and second semiconductor layers, an n-side electrode for electrical connection with the first semiconductor layer, and a p-side electrode for electrical connection with the second semiconductor layer, on the lower surface of a substrate having an upper surface, a lower surface, and a side face including an inclined plane inclining outward from the lower surface side to the upper surface side, a second step for preparing a support having n-side wiring and p-side wiring on the same plane, a third step for electrically connecting the n-side electrode and p-side electrode of the structure, and the n-side wiring and p-side wiring of the support, respectively, a fourth step for covering the inclined plane of the side face of the substrate with a light reflection member, and a fifth step for obtaining a light-emitting element by removing the substrate from the structure following to the fourth step, and forming a recess including a wall becoming higher from the upper end of the semiconductor layer toward the outside in the light reflection member. |
