摘要 |
Disclosed herein is a computer-implemented defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method comprising: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; determining or predicting, using the actual value, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the hot spot with the device manufacturing process. |
申请人 |
ASML NETHERLANDS B.V. |
发明人 |
FOUQUET, CHRISTOPHE, DAVID;KASTRUP, BERNARDO;DEN BOEF, ARIE, JEFFREY;MULKENS, JOHANNES, CATHARINUS, HUBERTUS;KAVANAGH, JAMES, BENEDICT;KOONMEN, JAMES, PATRICK;CALLAN, NEAL |