| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting element having a structure capable of suppressing adhesion to a bonding pad of a low molecule siloxane in a die-bonding process and reducing the number of processes of a wire boding process, and also to provide a method of manufacturing the same.SOLUTION: A light-emitting element 1 according to an aspect of the present information includes: a bonding pad 15 for bonding wire connection; and a coating film 16 made of a material obtained by mixing at least one kind of metal selected from a group of Ta, Ti, Pt, Mo, Ni, and W covering an upper surface 15u and a side surface 15s of the bonding pad 15 into Au. |
