| 发明名称 |
Methods of Packaging Semiconductor Devices and Structures Thereof |
| 摘要 |
Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies. |
| 申请公布号 |
US2015364395(A1) |
申请公布日期 |
2015.12.17 |
| 申请号 |
US201514833344 |
申请日期 |
2015.08.24 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lin Jing-Cheng;Hung Jui-Pin;Lin Yi-Hang;Tung Tsan-Hua |
| 分类号 |
H01L23/31;H01L25/065;H01L23/00;H01L23/538;H01L21/56;H01L21/3105;H01L25/00;H01L23/29 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A packaged semiconductor device, comprising:
at least two integrated circuits, each of the at least two integrated circuits having a plurality of sides, wherein a first bottom surface of a first one of the at least two integrated circuits and a second bottom surface of a second one of the at least two integrated circuits are planar with each other; a photosensitive material disposed around the at least two integrated circuits, the photosensitive material abutting the at least two integrated circuits on the plurality of sides of the at least two integrated circuits; a molding compound disposed adjacent to the at least two integrated circuits, wherein a top surface of the molding compound is planar with a top surface of the at least two integrated circuits; and a package disposed over the at least one integrated circuit and the photosensitive material. |
| 地址 |
Hsin-Chu TW |
