发明名称 |
TIN ELECTROPLATING BATH AND TIN PLATING FILM |
摘要 |
Provided is a tin electroplating bath for obtaining a tin plating film for which the occurrence of tin whiskers when an external stress is applied on the tin plating film is limited. The tin electroplating bath is characterized in comprising at least one kind of compound selected from a group consisting of flavonoid compounds and glycosides thereof, compounds with a xanthene backbone and glycosides thereof, and compounds with an acridine backbone and glycosides thereof. |
申请公布号 |
WO2015190390(A1) |
申请公布日期 |
2015.12.17 |
申请号 |
WO2015JP66187 |
申请日期 |
2015.06.04 |
申请人 |
C. UYEMURA & CO., LTD. |
发明人 |
KANO, TOSHIKAZU;IKUMOTO, RAIHEI;TSUJIMOTO, MASANOBU |
分类号 |
C25D3/32;C25D7/00 |
主分类号 |
C25D3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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