| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability.SOLUTION: A semiconductor device of an embodiment comprises an insulating resin, wiring, a plurality of semiconductor elements, a first conductive part, a first connection part and a first metal layer. The insulating resin includes a first region and a second region. In a first direction crossing a direction from the first region toward the second region, at least a part of the wiring is lined with at least a part of the first region. The plurality of semiconductor elements are provided between the first region and the wiring. At least one of the plurality of semiconductor elements is electrically connected with the wiring. The first conductive part pierces the second region in the first direction. The first connection part is away from the first conductive part in the first direction. At least a part of the first connection part is lined with at least a part of the wiring in a second direction crossing the first direction. The first metal layer is provided between the first conductive part and the first connection part and contacts the insulating resin. |
