SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE

摘要

A solid-state imaging device includes a light receiving section formed by such exposure as to stitch a plurality of patterns in a first direction on a semiconductor substrate. The light receiving section includes a plurality of pixels disposed in a two-dimensional array in the first direction and a second direction perpendicular to the first direction. Electric charges are transferred in the second direction in each of pixel columns consisting of a plurality of pixels disposed in the second direction, among the plurality of pixels.

主权项

1. A solid-state imaging device comprising a light receiving section formed by such exposure as to stitch a plurality of patterns together in a first direction on a semiconductor substrate,
wherein the light receiving section includes a plurality of pixels disposed in a two-dimensional array in the first direction and a second direction perpendicular to the first direction and transfers electric charges in the second direction, in each of pixel columns consisting of a plurality of pixels disposed in the second direction, among the plurality of pixels, and wherein in the light receiving section, a boundary where the plurality of patterns are stitched together is located along on at least one line segment extending in a direction intersecting with the first direction and the second direction.