| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-circuit board which improves the adhesion between IC and the board by increasing the area of contact between them. SOLUTION: The printed-circuit board comprises an insulating layer 2 wherein a first circuit pattern 4 including at least one or more via lands 4a is embedded in the upper part so that it has the same surface as the upper surface, while a second circuit pattern 8 formed at a position corresponding to the via land 4a is embedded in the lower part so that it has the same surface as the lower surface, a solder resist layer 12 which is laminated on the insulating layer 2, a via hole 6 which is formed in the insulating layer 2 so as to connect electrically the via land 4a and the second circuit pattern 8, and a bump 10 which is formed in an integrated type on the second circuit pattern 8 so that it pierces the via hole 6 and the via land 4a, and is provided in projection on the upper surface of the insulating layer 2 so that it has a height above the solder resist layer 12. COPYRIGHT: (C)2009,JPO&INPIT
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