| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has both high adhesive strength and electrical reliability after bonding, even if a bump shape is small. <P>SOLUTION: A semiconductor substrate 1 which has a connection electrode 2 and is provided with a first metal film 4 and a second metal film 5, and an electrical connection projection 10 on the connection electrode 2 is provided with a metal protection layer 6 adjacently to an outer circumferential part of the electric connection projection 10. When a wiring board 20 is bonded to the electrical connection projection 10, a deformed electric connection projection 10a which is the electronic connection projection 10 deformed as a result of the bonding comes into contact with a surface of the metal protection layer 6 to improve the adhesive strength and electric reliability after the bonding. Curing processing is not necessary, as in the case where a resist is used for a protective layer, and patterning is facilitated. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
