LIGHTING EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF

摘要

A lighting emitting diode package and fabrication method thereof is provided to prevent deterioration of productivity by preventing overflow of the resin by the upper ledge of the package body. A lighting emitting diode package and fabrication method thereof is comprised of steps: forming a seed layer on the surface of the package body having cavity(S101); forming a plating layer on the peripheral of the package body(S105); forming the conductive layer on the upper body surface within the cavity of the package body(S111); forming the domain which electrically is opened is formed by partly etching the seed layer, and the plating layer and conductive layer(S115) ; forming the mirror layer on the conductive layer(S119); mounting at least one light emitting diode chip on the mirror layer within cavity.