| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inspection method for optoelectronic circuit board, specifying defective portions, with optical elements being still packaged, as they are, and to provide an optical module and an optoelectronic circuit board. <P>SOLUTION: In this inspection method, an optical fiber 240, having a reflecting surface 240a inclined with respect to the longitudinal direction at the tip, is inserted between a first substrate 10 and a relay board where a light-emitting element is packaged on the first substrate 10 side, which are electrically connected via a solder ball 125, and a light signal from the light-emitting element is introduced as inspection light 3a into an optical power meter 250 via the optical fiber 240 to inspect the presence or absence of defective of the light-emitting element. <P>COPYRIGHT: (C)2009,JPO&INPIT |
