| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means for reinforcing the dynamical strength of a circuit board composed of a resin laminate and improving a heat dissipation characteristic through the circuit board, for the circuit board composed of the resin laminate and a semiconductor with a semiconductor chip mounted on the circuit board. <P>SOLUTION: The circuit board is provided with the resin laminate 41 composed of a plurality of build-up resin layers 41A to 41E each of which carries a wiring pattern 43 and has a via plug 43 connected to the wiring pattern, wherein first and second ceramic layers 47 and 48 having an elastic modulus larger than that of the build-up layers are formed on the top surface and bottom surface of the resin laminate, respectively, and at least one of the first and second ceramic layers has a rugged cross-section. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
