发明名称 |
METHOD FOR IMPROVING HEAT DISSIPATION IN ENCAPSULATED ELECTRONIC COMPONENTS |
摘要 |
A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier. |
申请公布号 |
EP1766679(A4) |
申请公布日期 |
2010.02.24 |
申请号 |
EP20040769650 |
申请日期 |
2004.10.15 |
申请人 |
NOKIA CORPORATION;EPCOS AG |
发明人 |
TIKKA, PASI;SCHMIDHAMMER, EDGAR;HEINZE, HABBO;WELZER, REINER;ZIDEK, HERBERT;SCHAUFELE, ANSGAR;ELLAE, JUHA |
分类号 |
H01L23/28;H01L21/60;H01L23/31;H01L23/36;H03H3/02;H03H3/08;H03H9/10 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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