ADHESIVE FILM, CONNECTION METHOD, AND ASSEMBLY

摘要

Disclosed are: an adhesive film which enables to connect an electronic component to a substrate without causing short-circuiting; a connection method; and an assembly. The adhesive film comprises a first adhesive layer and a second adhesive layer closely adhered to the first adhesive layer. The first adhesive layer has a minimum viscosity higher than that of the second adhesive layer, wherein the minimum viscosity is measured at a temperature equal to or lower than the curing start temperature at which the first or second adhesive layer starts to cure. The first and second adhesive layers are faced toward a substrate and an electronic member, respectively, so that the electronic member can be connected to the substrate by pressing against the substrate and the electronic member while heating. The first adhesive layer has an electrically conductive particle dispersed therein, and has a thickness less than twice the average particle diameter of the electrically conductive particle.