发明名称 PRINTED WIRING BOARD, WIRING MANUFACTURING METHOD, AND CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide: a printed wiring board which is reducible in resistance value; a wiring manufacturing method; and a conductive paste. SOLUTION: A wiring pattern printed using a first conductive paste obtained by kneading silver powder is covered with a second conductive paste obtained by kneading carbon powder and metal powder finer than the carbon powder with each other. Further, the second conductive paste is obtained by kneading fine particles of metal which hardly causes ion migration as compared with silver with the carbon powder. The metal is one or a plurality of nickel, copper, palladium, and cobalt, an alloy thereof, or a mixture thereof. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010021371(A) 申请公布日期 2010.01.28
申请号 JP20080180698 申请日期 2008.07.10
申请人 FUJITSU LTD 发明人 KITAJIMA MASAYUKI;ISHIZUKA TAKESHI;EMOTO SATORU
分类号 H05K1/09;H01B1/24;H01L21/288;H01L21/3205;H01L23/14;H01L23/52;H05K3/12 主分类号 H05K1/09
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