| 摘要 |
FIELD: technological processes. ^ SUBSTANCE: invention is related to the field of forming and may be used to separate newly assembled parts or their initial materials. Force of break separation is applied to part perpendicularly to desired plane of break separation. Prior to application of this force, compressing force is applied to part. This force causes stretching stresses, which are perpendicular to plane of break separation and have maximum in this plane. Compressing force is calculated based on creation of stretching stresses, which are less than part material yield point. Compressing force is applied by means of wedges or cutting grips. Wedges or grips by their sharp top or edges act pointedly or linearly simultaneously on opposite sides of break separation plane along circumferential line. Circumferential line lies in plane of break separation. Action of compressing force is preserved at the moment of break separation force application. ^ EFFECT: invention provides for improved quality of separation by prevention of shift of break separation actual plane from desired one and reduced force of break separation. ^ 6 cl, 4 dwg |
