ANNEALING A BUFFER LAYER FOR FABRICATING ELECTRONIC DEVICES ON COMPLIANT SUBSTRATES

摘要

PURPOSE: An annealing a buffer layer for fabricating electronic devices on compliant substrates compensate thermal expansion and contraction by processing all process under a temperature at which a plastic deformation is not generated. CONSTITUTION: A method for manufacturing an electronic device laminated on a flexible substrate is comprised of the steps: forming a buffer layer on a flexible substrate; heating the buffer layer and the flexible substrate by an anneal temperature higher than the temperature at which the buffer layer is deformed; cooling the buffer layer and the flexible substrate; and forming an electronic device which is laminated on the buffer layer and the flexible layer under a temperate which is not over the anneal temperature.