| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for evaluation, which excellently copes with many kinds and is excellent in usability. SOLUTION: The substrate for evaluation is used for evaluation of the function of an electronic component mounter. The substrate for evaluation is provided with a plurality of land groups which are different in shape and size and used for performing a mounting operation for evaluation, targeting each of a plurality of kinds of electronic components including at least chip- and package-type electronic components; and an overlap arrangement land columns 2c in which land columns 2b corresponding to leads provided on the sides opposite each other of the electronic components adjacent to each other are provided so as to overlap in the same area, as a land arrangement pattern for mounting the package-type electronic component. With this configuration, visual inspection of the mounting position accuracy is allowed and the substrate for evaluation which excellently copes with many kinds and is excellent in usability is provided. COPYRIGHT: (C)2009,JPO&INPIT
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