| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of analyzing semiconductor failure which efficiently specify a cause of failure, system of determining a priority of failure analysis, and a method of manufacturing a semiconductor device which establishes improved manufacturing yield. SOLUTION: Respective results of trouble diagnosis, physical analysis and inline test are substituted with physical positions and area on corresponding semiconductor chips. An overlapping part of the substituted areas with any two or more combinations among the three results is obtained. When an analysis object is in initial status, the priority is determined as a top, depending on the size of area with a combination of the three results including the result of the inline test, and as a second priority, depending on the size of area of a combination of the one result including the result of the inline test. When the analysis object is in matured status, the priority is determined depending on the size of area with a combination of the two results excluding the result of the inline test. According to the determined priority, a concrete failure cause is analyzed. COPYRIGHT: (C)2009,JPO&INPIT
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