PACKAGED MICROCHIP WITH SPACER FOR MITIGATING ELECTRICAL LEAKAGE BETWEEN COMPONENTS
摘要
A packaged microchip has a base, at least one spacer coupled to the base, and first and second microchips mounted to the at least one spacer. The at least one spacer is configured to substantially prevent leakage current between the first and second microchips.
申请公布号
WO2009055365(A3)
申请公布日期
2009.06.18
申请号
WO2008US80605
申请日期
2008.10.21
申请人
ANALOG DEVICES, INC.;PAGKALIWANGAN, ANGELO;GRIFFIN, GARRY
