发明名称 CHEMICAL-MECHANICAL POLISHING COMPOSITION AND METHOD FOR USING THE SAME
摘要 The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising alpha-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of alpha-alumina, gamma-alumina, delta-alumina, theta-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.
申请公布号 US2009152240(A1) 申请公布日期 2009.06.18
申请号 US20090393489 申请日期 2009.02.26
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 DE REGE THESAURO FRANCESCO;MOEGGENBORG KEVIN J.;BRUSIC VLASTA;BAYER BENJAMIN P.
分类号 B44C1/22;C09G1/02;H01L21/321 主分类号 B44C1/22
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