| 摘要 |
<p>A wet cleaning device of a wafer is provided to reduce a cost by commonly using a wafer cassette separating unit, a wafer cassette coupling unit, a wafer cassette loading unit, and a wafer cassette unloading unit. A wafer cassette loading unit(110) transfers a cassette to a wafer cassette transferring robot. A wafer cassette separating unit(120) separates the cassette mounting the wafer to the wafer and the cassette. An SPM(Sulfuric Acid Peroxide Mixture) bath(130) removes the photoresist from the wafer. A C/C(Chuck Clean) bath(140) cleans a chuck of a first wafer transferring robot. An HQDR(Hot Quick Dump Rinse) bath(150) cleans the wafer. An APR(Ammonium Peroxide Replacement) bath(160) cleans the particle and the organic compound of the wafer. A drier(170) dries the wet-cleaned wafer. A wafer cassette coupling unit(180) couples the wafer with the cassette. A wafer cassette unloading unit(190) unloads the cassette combined with the wafer.</p> |
