发明名称 |
SLICING METHOD |
摘要 |
The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wherein a cooling speed of the ingot when a slicing depth is equal to or above 2/3 of a diameter is controlled to perform slicing by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while controlling a supply temperature only in a period from the moment that the slicing depth of the ingot reaches at least 2/3 of the diameter to end of slicing. As a result, the slicing method is provided, in which rapid cooling of the ingot in the time close to end of slicing the ingot can be alleviated when a wire saw is used to slice the ingot, and generation of a nano-topography can be thereby suppressed and further high quality wafers having a uniform thickness are obtained by slicing. |
申请公布号 |
EP2070653(A1) |
申请公布日期 |
2009.06.17 |
申请号 |
EP20070792170 |
申请日期 |
2007.08.08 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
OISHI, HIROSHI;NAKAMATA, DAISUKE |
分类号 |
B24B57/02;B24B27/06;B28D5/04;H01L21/304 |
主分类号 |
B24B57/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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