SOLDER MELTING METHOD, METHOD FOR MANUFACTURING MOUNTING SUBSTRATE, AND SOLDER MELTING APPARATUS

摘要

A solder melting method for suitably melting a solder for connecting an electronic component and a substrate is provided. When nOE solder balls of a BGA (Ball Grid Array) are arranged in the vertical and horizontal directions, a laser beam is applied in a direction (direction "A") inclined from the solder ball arrangement direction by an angle (?). The laser beam is applied to all the solder balls by moving the optical axis of the laser beam to a direction (direction "B") intersecting with the optical axis "A".